Enclosure Mold
Challenge: IP65 sealing with integrated gasket groove; large flat surface prone to sink marks; PCB mounting boss positional accuracy.
Solution: Precision gasket groove (±0.05mm depth), rib-to-wall ratio at 50%, baffled cooling on thick boss areas to prevent sink.
Result: IP65 sealing achieved, flatness 0.1mm on 300mm span, boss position ±0.1mm for automated PCB assembly.
| Material | PC/ABS blend |
| Cavities | 2 |
| Rating | IP65 |
| Cycle Time | 38s |
| Surface | MT-11020 texture |
| Mold Size | 600 × 500 × 450 mm |
